Every time we pick up a smartphone, we experience lightning-fast performance—but we rarely think about the hidden “precision secrets” behind it. One of the unsung technologies supporting the entire semiconductor manufacturing chain is the CNC machine. Every step, from wafer slicing to packaging, demands absolute nanometer-level precision—any tiny error can render an entire chip useless. This is a little-known factor that can determine market leadership.

The third-generation semiconductor is currently the hottest topic in the high-tech field, and plays an indispensable role in the development of 5G, electric vehicles, renewable energy, and Industry 4.0. What is the third generation of semiconductors? In this article, we will take you to understand this key technology that can affect the future of the technology industry from the most simple and comprehensive perspective.

Wafer-level packaging (WLP) has gained traction over the past decade as the semiconductor industry continues to push for generations of higher-performance chips. Back-end packaging technologies are becoming increasingly important in meeting the demands of low-latency, high-bandwidth, and low-cost semiconductor devices.