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Semiconductor supply chain include all kinds of semiconductor manufacturing and design industries, such as IC manufacturing, IC packaging and testing, IC design, and discrete component manufacturing.
The automotive semiconductor market continues to be optimistic. At present, the main automotive semiconductor chips include microcontrollers (MCU), power management ICs, digital signal controllers (DSP), sensors, power semiconductors, discrete components, micro-electromechanical (MEMS), memory, customized application IC (ASIC), etc. The automotive chip supply chain is complex and long. After the shortage storm in 2021, automakers began to shorten the semiconductor supply chain, hoping to shorten the long chain. Some automakers even have the idea of developing and designing automotive semiconductors by themselves.
Lasers are used in a wide range of industries, especially in processing. The entire laser processing industry is currently moving in the direction of high power, ultra-short pulse, and intelligence.
The shortage of supply in the PMIC market is expected to continue. The key lies in the increase in the supply side. In the future, we should continue to observe the changes in the general environment.
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In the semiconductor news, wafers are always mentioned in terms of dimensions, such as 8-inch or 12-inch wafers, but what exactly is a so-called wafer? What does the 8 inches refer to? How difficult is it to produce large-sized wafers? The following is a step-by-step introduction to the most important foundation of semiconductors - what is a "wafer".
The third-generation semiconductor is currently the hottest topic in the high-tech field, and plays an indispensable role in the development of 5G, electric vehicles, renewable energy, and Industry 4.0. What is the third generation of semiconductors? In this article, we will take you to understand this key technology that can affect the future of the technology industry from the most simple and comprehensive perspective.
Wafer-level packaging (WLP) has gained traction over the past decade as the semiconductor industry continues to push for generations of higher-performance chips. Back-end packaging technologies are becoming increasingly important in meeting the demands of low-latency, high-bandwidth, and low-cost semiconductor devices.
Lithography is the most important processing technology of integrated circuits and the most critical technology for manufacturing chips. In the entire chip manufacturing process, the implementation of almost every process is inseparable from the technology of lithography.
Taiwan's semiconductor industry is booming, and sub-industries such as wafer foundry, back-end packaging, and testing, and IC design are among the best in the world.
Exhibition Products Device Dram/Flash Memory, MCP, Memory module AP, MPU/MCU, DSP, DDI, PMIC, RFIC SoC etc. Foundries/Packaging Service RFIDTag,SmartCard,Sensor,MEMS etc. Flat Panel Display(LCD,PDP,OrganicELEtc) Factory FacilityAir Filtering, Clean Rooms, Flow Process Control, etc. Components & PartsProcess Equipment, S...
Hybrid SEMICON West connects the entire extended electronics supply chain in one place, at one time. It’s the smart way to re-connect with your contacts, customers, partners, plus drive your business forward. 
The first and second generations of semiconductors used silicon (Si) and gallium arsenide (GaAs) as their base material. Wide Bandgap semiconductors refer to new semiconductors produced in a third generation of semiconductors which use silicon carbide (SiC) and gallium nitride (GaN) as their base material.
GaN and SiC - Third-generation semiconductor materials have been widely used in producing blue and green LEDs and lasers. GaN and SiC production has become an essential technology for many semiconductor manufacturers.