Taiwan-based KYMC will showcase integrated flexographic printing and coating solutions, along with the North American debut of its plastic-free and PFAS-free barrier coating technology, at PACK EXPO International 2026 in Chicago.
As packaging and processing companies navigate pressure to improve efficiency, manage supply-chain uncertainty, meet sustainability targets and maintain product safety, PACK EXPO International 2026 will bring education and equipment demonstrations together at McCormick Place in Chicago from October 18–21.
Organized by PMMI, the Association for Packaging and Processing Technologies, the event is expected to unite more than 2,700 exhibitors and professionals from more than 40 industry sectors across 1.3 million net square feet of exhibit space. Organizers say the show will also offer more than 150 free educational sessions on the show floor, giving attendees a way to connect broad industry trends with technologies they can examine in operation.
Among the exhibitors preparing to address these production and sustainability questions is Kuen Yuh Machinery Engineering Co., Ltd., also known as KYMC, a Taiwan-based manufacturer of flexographic printing, coating and laminating machinery. KYMC will exhibit at West Hall, Booth W-21056, in the Healthcare Packaging Pavilion, according to the official PACK EXPO International exhibitor directory.
Education Designed Around Practical Industry Challenges
The show’s education program is organized across five destinations: the Innovation Stage, Food & Beverage Processing Innovation Stage, Industry Speaks, Sustainability Central and the Reusable Packaging Learning Center. The program is designed to cover automation, digitalization, operational excellence, sustainability, food safety, supply-chain issues and other operational challenges affecting packaging and processing companies.
The program’s format is intended to make education part of the show-floor experience rather than a separate conference track. The Innovation Stage, for example, will feature short sessions on emerging technologies and production strategies, while Sustainability Central will focus on circularity and approaches that can help brands advance environmental goals. The Food & Beverage Processing Innovation Stage will address developments in processing, including food safety and related production requirements.
That combination of learning and live demonstrations is particularly relevant to converters and brand owners evaluating packaging equipment. Decisions about printing, coating, laminating and converting affect not only product appearance, but also material use, barrier performance, production speed, waste, labor requirements and the ability to move from one process step to the next.
KYMC to Showcase Integrated Printing and Coating Workflows
At PACK EXPO International 2026, KYMC says it will highlight coating applications integrated inline with flexographic printing. The company describes the approach as a way to connect printing and coating within a coordinated production workflow, with the aim of reducing process complexity and improving operational efficiency.
KYMC’s official PACK EXPO announcement says the company will present fully integrated solutions that combine its machinery with customer-side processing equipment. The company identifies three intended outcomes: higher value-added processing, improved economic efficiency through optimized workflows, and more seamless automation for modern manufacturing requirements.
The company’s product portfolio includes flexographic printing presses, coating and laminating equipment, rotogravure presses, slitting and rewinding systems, and other converting machinery. KYMC’s website also lists packaging applications ranging from flexible packaging and corrugated boards to cartons, paper cups, paper and plastic bags, and diaper and pad materials.
For flexible packaging, KYMC lists processes such as flexographic or rotogravure printing, solventless and other coating methods, duplex and multilayer lamination, and converting operations including slitting, laser pattern cutting, perforation and scoring. These capabilities are relevant to manufacturers working with film, paper and aluminum foil substrates for food, medical and other packaged products.
North American Debut for a Plastic-Free, PFAS-Free Barrier Coating Technology
A key focus at KYMC’s booth will be the North American debut of a next-generation barrier coating technology, according to the company’s exhibitor profile. KYMC says the solution was developed with strategic partners and combines specially engineered process equipment with plastic-free and PFAS-free materials.
The company says the resulting barrier layers are designed to provide functional resistance to oil, water and aroma while supporting food-contact safety. KYMC further describes the materials as biodegradable and positions the system as an alternative for packaging applications seeking barrier performance without conventional plastic-based or PFAS-containing components. These performance and environmental descriptions are claims made by KYMC and should be evaluated by prospective users against their own substrate, regulatory, food-contact and end-use requirements.
The exhibitor profile also emphasizes customization. KYMC says it works with converters to configure coating heads, drying systems and process parameters for specific substrates and applications. This is important because barrier coating requirements can vary significantly depending on the substrate structure, coating chemistry, target barrier properties, production speed and downstream converting process.
KYMC’s broader company profile states that the business was founded in 1968 and has supplied printing and converting equipment to customers in more than 90 countries, with more than 2,800 installations. The company presents customer-specific engineering and long-term technical support as central parts of its operating model.
A Meeting Point for Technology Decisions
For attendees, the value of PACK EXPO International 2026 will extend beyond viewing individual machines. The event provides a setting to compare equipment approaches, attend technical sessions and discuss how technologies can fit existing production lines. The official show program encourages attendees to use the education schedule to plan sessions while exploring suppliers on the exhibition floor.
KYMC’s presence adds a focused case study to that broader conversation. Its planned display connects several issues shaping packaging investment decisions: inline integration, coating precision, barrier performance, process efficiency and the search for materials that can meet evolving sustainability expectations.
Visitors interested in flexographic printing, coating, laminating and customized barrier solutions can meet KYMC at West Hall, Booth W-21056. PACK EXPO International 2026 will run at McCormick Place, 2301 S. King Drive, Chicago, from 9:00 a.m. to 5:00 p.m. on October 18–20 and from 9:00 a.m. to 3:00 p.m. on October 21. Registration and the full education schedule are available through the official PACK EXPO International website.
About KYMC
Kuen Yuh Machinery Engineering Co., Ltd. (KYMC) is a Taiwan-based manufacturer of printing and converting equipment. Founded in 1968, the company supplies flexographic printing, coating, laminating, rotogravure, slitting and rewinding solutions for flexible packaging and related applications. KYMC is headquartered at No. 8, Jingke Road, Nantun District, Taichung City, Taiwan.
Editorial note: The descriptions of KYMC’s debut barrier-coating technology, material properties and expected performance are based on statements published by KYMC and its PACK EXPO exhibitor profile. No independent performance testing or regulatory certification has been added to this article.
